MediaTek Dimensity 1050, Dimensity 930, Helio G99 processors launched
MediaTek has announced a new processor called the Dimensity 1050; it's the first mmWave 5G chipset to provide seamless connectivity, display, gaming and power efficiency for next-generation 5G smartphones. Using dual mmWave and sub-6GHz connectivity, the Dimensity 1050 will provide the speed and capacity needed to provide smartphone users with an enhanced experience, even in some of the most densely populated areas. MediaTek Dimensity 1050 Specifications The Dimensity 1050 combines mmWave 5G and sub-6GHz for smooth migration between network bands and is built on TSMC's 6nm production process and octa-core CPU. Density 1050 supports 3CC carrier aggregation on the sub-6 (FR1) spectrum and 4CC carrier aggregation on the mmWave (FR2) spectrum. Dimensity 1050 will provide up to 53% more power to smartphones compared to LTE + mmWave aggregation alone speed and excellent coverage. The SoC integrates two Arm Cortex-A78 CPUs with rates up to 2.5GHz and the latest Arm Mali-G610 graphics...